Data Foundry

Medical device recalls 2023

epoc BGEM BUN Test Card with epoc Host SW v3 — Class II medical device recall Z-2476-2023

Ongoing recall by Siemens Healthcare Diagnostics Inc, reported 2023-09-06, distributed in AL, AR, AZ, CA, CO, DC, DE, FL…. There is potential for discrepant high glucose results in samples with glucose results on the lower end of the

Recall numberZ-2476-2023
Product typeMedical device
ClassificationClass II
StatusOngoing
Voluntary or mandatedVoluntary
Recalling firmSiemens Healthcare Diagnostics Inc, Norwood, MA, United States
Recall initiated2023-06-01
Classified2023-08-28
Reported by FDA2023-09-06
DistributedAL, AR, AZ, CA, CO, DC, DE, FL, IA, ID, IL, KS, KY, LA, MI, MN, MO, NC, ND, NH, NY, OH, OK, SC, SD, TX
Countries outside the USAE, CA, CN, CO, FI, IN, MX, NO, SE, VN
Quantity3,201 units
UPC / GTIN / UDI-DI00809708121860
Lot numbers04-23003-60
Expiration dates2023-05-20, 2023-06-20, 2023-07-21, 2023-08-15, 2023-08-25

Product

epoc BGEM BUN Test Card with epoc Host SW v3.37.3, epoc NXS SW v4.10.6, Sensor Configuration 41.1

Reason for recall

There is potential for discrepant high glucose results in samples with glucose results on the lower end of the reportable range.

Machine access

This record, with every extracted code, the verbatim FDA record and provenance, is available from the recall API: GET https://api.data.aroqon.com/v1/recalls/Z-2476-2023. Look up any UPC, UDI, NDC or lot with /v1/recalls/lookup?code=…. API docs · free and paid keys.

Source: U.S. Food and Drug Administration enforcement report via openFDA (CC0). Structured by Data Foundry (recall-structuring@2); last changed 2026-09-26. Not affiliated with or endorsed by FDA. Not medical or legal advice.